Encapsulant    OPD-series,ENP-series
  ・Potting
   Clear to colored,filter,low moisture absorption,low gas permeability,low stress,high heat 
   discoloration resistance.
 ・Casting
   Clear to each color filter,low moisture absorption,low gas permeability low stress,high heat
   discolration resistance.
 
 Conductive adhesive   AG-series
  ・General-purpose conductive paste   LED to LSI(large-chip small chip)
   Low moisture absorption,low stress,high heat resistance,void-free,low impurityion,
   halogen-free.
 ・High thermal conductivity paste  high brightness LED~power devices
   Thermal conductiveity ≒ 20w/mk Special filler shaped Ag powder is high loaded.
 ・Stmping paste
   Viscosity and thixotroopic are adapted for the speed stamping.
 ・Long working life
   Characteristic:24hours or more (dispense Stamping) at room temperature.
 
 Insulative adhesive   Sl-series
 ・Die attach insulating paste
   Low moisture absorption,low stress,high heat resistance,void-free,low impurityion,
   halogen-free
 ・Under fill
   High filling speed,low moisture absorption,low stress,high heat resistance,void-free.
 ・Transparent die attach paste
   High heat discoloration resistance,low moisture absorption.low stress.
 ・High reflectiveity paste
   UV~visible light high reflectivity,high heat discoloration resistance,low moisture
   absorption,low stress.
 
 UV Cure   UV-series
 ・UV cure paste
   UV curable adhesive based on epoxy resin for enhance productivity.This is made by one
   component without solvent.
 
 Thermal Polymerization resin   TP-series
 ・Long working life
 ・wide range curing temperature



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